VTT-Technical Research Centre of Finland

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AG Organic Electronics Association

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VTT-Technical Research Centre of Finland

Tekniikantie 21, FI-02044 Espoo, Finland

Phone: (+35 82) 07 22 111 | Fax: (+358 20) 7 22 23 20 | E-Mail: antti.kemppainen@vtt.fi

Website: https://www.vttresearch.com/

Production program

oea:

Region
- Europe
Core Competence
- R&D Institute
Encapsulation
- thin film encapsulation
- polymer film encapsulation
- glass encapsulation
Equipment / Processes
- gravure printing
- flexographic printing
- screen printing (flat bed)
- screen printing (rotary)
- digital printing
- inkjet printing
- aerosol jet printing
- 3D printing
- thermal transfer printing
- other printing
- PVD - evaporation
- PVD - sputtering
- organic vapor phase deposition
- CVD - chemical vapor deposition
- ALD - atomic layer deposition
- spin coating
- spray coating
- slot-die coating
- other coating (dip, blade, ...)
- dispensing
- in-mold electronics (IME)
- overmolding
- thermoforming
- nanoimprint lithography
- photolithography
- laser structuring
- laser ablation
- laser drilling and cutting
- thermal drying /thermal ovens
- UV curing
- thermal soldering
- surface mount technologies (SMT)
- pick and place
- encapsulation
- clean room
- ink formulation & manufacturing
- dosing, metering & mixing of inks and fluids
- recycling
- other equipment / processes
Devices
- transistors
- memory elements
- antennas
- passives (e.g. capacitors, resistors)
- OLEDs
- electroluminescence
- flexible displays
- other display technologies
- touch screens / surfaces
- touch sensors
- capacitive sensors
- pressure sensors
- biosensors
- strain sensors
- gas sensors
- temperature sensors
- humidity sensors
- sensors (devices)
- photovoltaic cells
- perovskite solar cells
- OPV - organic photovoltaic cells
- batteries
- supercapacitors
- fuel cells
- thermoelectrics
- ultrasonic transducers
- heaters
- conductive traces
- other devices
Integration
- hybrid systems
- electrical contacting (e.g. flip-chip)
- lamination
- integration into packaging
- electronic packaging technology
- surface mount technologies (SMT)
- other (integration)
Testing
- electrical characterization
- physical/optical characterization
- chemical characterization
- electrochemical characterization
- microscopic characterization
- spectral characterization
- surface metrology
- transmission/ reflection/ absorption
- oxygen and water diffusion testing
- accelerated damp heat testing
- UV exposure testing
- abrasion resistance testing
- mechanical testing
- thermal characterization
- Reliability
- lifetime
- quality / process control
- inline quality and process control
- inline film thickness measurement
- inline vision systems
- inline optical inspection
- environmental testing
- environmental reliability testing
- sustainability/life cycle assessment
- simulation / circuit optimization
- design
Applications by Industry
- automotive
- space
- defense
- consumer electronics
- healthcare, medical and pharmaceutical
- sports goods, wellbeing
- lighting (applications by industry)
- energy
- photovoltaics
- retail and logistics
- packaging
Applications
- sensors (applications)
- lighting (applications)
- transistors
- touchscreen and surfaces
- energy harvesting
- solar cells
- energy storage
- smart objects (e.g. smart cards, games, gadgets)
- smart patch
- smart labels
- smart/security packaging
- RFID
- smart textiles
- wearables
Other Services
- technical consulting
- management of R&D funding programs
- research and development
- prototyping

The Product search of the VDMA Verlag

Find companies and institutes in the organic and printed electronics industry

VTT-Technical Research Centre of Finland